반복 수심 변화 환경에서 수중 센서 모듈 접속부의 수밀 고장 메커니즘 및 신뢰도 영향 분석
Ⓒ 2026 Korea Society for Naval Science & Technology
초록
본 연구는 반복 수심 변화 환경에서 운용되는 수중 센서 모듈 접속부의 수밀 고장 메커니즘과 신뢰도 영향성을 분석하였다. 접속부를 커넥터 체결부, 케이블 인입부, O-ring/실링부, 몰딩재 경계면 및 내부 전기 접점으로 구분하고, 반복 수압, 유속·진동, 케이블 굽힘, 커넥터 미세 풀림 및 몰딩재 열화가 수분 침투 경로 형성에 미치는 영향을 검토하였다. 분석 결과, 접속부 수밀 고장은 단일 요인보다 구조·환경 하중과 재료 열화가 복합적으로 작용하여 발생할 가능성이 높으며, 수분 침투 이후에는 전기적 신뢰도 저하로 이어질 수 있다. 특히 커넥터 미세 풀림은 실링 압축률 저하를 통해 즉각적인 수밀 상실을 유발할 수 있는 핵심 고장유형으로 판단된다. 본 연구는 정수압 및 유속 항력의 공학적 기본식을 분석 배경으로 활용하고, 향후 반복 가압·감압 시험과 FMEA 기반 정량적 우선순위 평가 방향을 제시하였다.
Abstract
This study analyzes watertightness failure modes and their effects on the reliability of underwater sensor module interfaces under repeated depth-cycling conditions. The scope of the interface analysis is considered in terms of connector fastening, cable inlet, O-ring/sealing section, molding-material interfaces, and internal electrical interfaces. The effects of cyclic hydrostatic pressure, flow-induced vibration, cable bending, connector micro-loosening, and molding degradation are reviewed. The analysis indicates that watertightness failure is likely to result from the combined effects of structural and environmental loading and material degradation rather than a single factor, while subsequent moisture ingress may lead to electrical reliability degradation. In particular, connector micro-loosening may immediately reduce sealing compression and cause rapid loss of watertightness integrity. This study uses basic engineering relationships for hydrostatic pressure and drag as analytical framework and suggests future cyclic pressure testing and FMEA-based quantification.
Keywords:
Underwater Sensor Module, Watertightness Failure Mechanism, Repeated Depth Cycling, Connector Micro-Loosening, Reliability키워드:
수중 센서 모듈, 수밀 고장 메커니즘, 반복 수심변화, 커넥터 미세 풀림, 신뢰도References
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